Temperature resistant and liquid epoxy resin system, specially for industrial use. Non-corrosive, anti-magnetic, cures practically without shrinkage.
WEICON C is particularly suitable as an adhesive for large-scale applications, for pouring out molds and for the production of fixing devices and tools (e.g. injection molds). It can be used in the tool and mold-making sector, as well as in many other industrial areas subjected to high thermal stress.